Structure of embedded capacitor
OwnerWan-Ling Yuinventor
Life of this patent
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Abstract
The embedded capacitor of the present invention contains a power plate, a ground plate, and a dielectric layer vertically sandwiched between the power and ground plates. Both the power and ground plates are divided laterally into a number of smaller plates with appropriate gaps therebetween; and, as such, cracks in the dielectric layers are limited to happen between gaps only. The smaller plates are then electrically connected by connectors in the gaps. The connectors for the power plate and the connectors for the ground plate are not vertically overlapped so that they do not appear simultaneously at the two ends of the cracks simultaneously.
Claims7
An embedded capacitor structure for a laminated printed circuit board, comprising:
- a metallic power plate, said power plate having a plurality of smaller first plates, any two adjacent first plates having an appropriate gap therebetween, and said two adjacent first plates being electrically connected by at least a first connector;
- a metallic ground plate, said ground plate having a plurality of smaller second plates, any two adjacent second plates having an appropriate gap therebetween, and said two adjacent second plates being electrically connected by at least a second connector;
- and
- a dielectric layer vertically sandwiched between said power plate and said ground plate.
Dependencies are inferred from the claim text.