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US 7,733,212 B2Granted
Resistor
AssigneeHewlett-Packard Development Company, L.P.
InventorsPeter James Fricke, Alan R. Arthur
Life of this patent
Estimating the term…
Abstract
Embodiments of a resistor are disclosed.
Claims21
A resistor, comprising:
- a bulk resistor film;
- a first set of patterned conductor protrusions, disposed adjacent the bulk resistor film;
- and
- a second set of patterned conductor protrusions disposed adjacent the bulk resistor film and interleaved with the first set of conductor protrusions to provide a plurality of resistive paths to the first set of patterned conductor protrusions through the bulk resistor film.
1 more element
A resistor for an address line, comprising:
- a first set of fingerlike conductors from the address line disposed adjacent to a bulk resistor film;
- a second set of fingerlike conductors adjacent the bulk resistor film being interleaved with the first set of fingerlike conductors, wherein the interleaved first and second set of fingerlike conductors form a serpentine shape using the bulk resistor film;
- and
- a contact electrically coupled to the second set of fingerlike conductor protrusions and a select line.
1 more element
A resistor configured to connect an electrode in an array of electrically controllable elements to a decoded signal, comprising:
- a planar bulk resistor film;
- an address line having fingered traces formed adjacent to the bulk resistor film, the fingered lines being configured to connect a plurality of impedances;
- a contact trace having fingered traces in proximity to the address line fingered traces;
- a serpentine shaped impedance formed using the bulk resistor film between the address line fingered traces and the contact trace fingered traces;
- an ohmic contact disposed on the contact trace;
- and
- a select line having a first end connected to the ohmic contact and a second end connected to the array of electrically controllable elements.
4 more elements
A method for forming a resistor, comprising:
- embossing an address line via having fingered traces in a resin, the fingered traces being configured to drive a plurality of impedances;
- embossing a contact trace via having fingered traces in the resin in proximity to the address line fingered traces;
- electroplating metal in the contact trace and address lines;
- building up a contact bump on top of the contact trace;
- and
- applying a bulk resistor film adjacent to the address lines and contact trace to form a serpentine shaped impedance using the bulk resistor film between the address line fingered traces and the contact trace fingered traces.
3 more elements
Dependencies are inferred from the claim text.