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US 7,733,106 B2Granted
Apparatus and method of testing singulated dies
AssigneeFormFactor, Inc.
InventorsThomas H. Dozier, II, Benjamin N. Eldridge, David S. Hsu, Igor Y. Khandros, Charles A. Miller
Life of this patent
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Abstract
An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
Claims30
A die carrier apparatus comprising:
- a carrier configured to receive a plurality of singulated dies thereon;
- a base;
- and
- a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,
- wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,
- the first interface device comprising:
- a plurality of resilient probes disposed within the enclosure on a first surface of the first interface device and patterned to contact the plurality of singulated dies when disposed on the carrier,
- a first electrical interface disposed outside of the enclosure on a second surface of the first interface device opposite the first surface, the first electrical interface being directly opposite the plurality of resilient probes, and
- electrical connections between ones of the probes and the first electrical interface.
6 more elements
A die carrier apparatus comprising:
- a carrier configured to receive a plurality of singulated dies thereon;
- a base;
- and
- a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,
- wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,
- the first interface device comprising:
- a plurality of probes disposed within the enclosure and patterned to contact the plurality of singulated dies when disposed on the carrier,
- a first electrical interface disposed outside of the enclosure, and
- electrical connections between ones of the probes and the first electrical interface,
- wherein the die carrier apparatus is configured to receive as an attachment a second interface device, the second interface device comprising:
- first electrical connectors configured to contact the first electrical interface, and
- a second electrical interface,
- wherein ones of the first electrical connectors are electrically connected to the second electrical interface,
- wherein the second interface device is attached to the die carrier apparatus with a mechanical engagement that selectively and releasably tightens the second interface device to the die carrier apparatus in a manner that allows the second interface device and the die carrier apparatus to be placed in and removed from the testing system while being tightened together as a single unit.
11 more elements
A die carrier apparatus comprising:
- a carrier configured to receive a plurality of singulated dies thereon;
- a base;
- and
- a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,
- wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,
- the first interface device comprising:
- a plurality of probes disposed within the enclosure and patterned to contact the plurality of singulated dies when disposed on the carrier,
- a first electrical interface disposed outside of the enclosure,
- electrical connections between ones of the probes and the first electrical interface, and
- compression stops,
- wherein the plurality of probes extend from the first interface device by a distance that is greater than a height of the compression stops.
8 more elements
Dependencies are inferred from the claim text.