Light emitting device having an optical modification element with uniform thickness

A method of manufacturing a light emitting device, said method comprising:

• forming a cavity in a substrate;
• mounting at least one light emitter within said cavity;
• filling at least a portion of said cavity with a first transparent material, said first transparent material encapsulating said at least one light emitter;
• fabricating a planar optical modification element, said optical modification element comprising particles that emit at least one first wavelength of light upon being illuminated by a second wavelength of light, said optical modification element having a first side located adjacent said first transparent material and a second side located opposite said first side, said first side being substantially flat, and said optical modification element being substantially uniform in thickness;
• and
• locating said optical modification element adjacent said first transparent material;
• fabricating a second transparent material having a first side and a second side, wherein said first side of said second transparent material includes a recessed portion configured to receive said optical modification element;
• locating said first side of said second transparent material adjacent said second side of said optical modification element.