Semiconductor package with mold lock vent

A semiconductor package comprising:

• a leadframe having first and second major surfaces and including a mold lock opening extending between the first and second major surfaces;
• a semiconductor die coupled to the first major surface;
• and
• an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, wherein the unfilled portion of the mold lock opening forms a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached, wherein the vent has a cross-sectional area less than a cross-sectional area of the mold lock opening at the first major surface.