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US 7,732,936 B2Granted
Buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer
AssigneeIntel Corporation
InventorsMichael D. Goodner, Kevin J. Lee
Life of this patent
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Abstract
Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein, wherein the buffer coating is provided by mechanically blending a first polymer with at least a second polymer. The mechanically blended polymers producing a buffer coating that provides a barrier that is has an increased toughness and decreased shrinkage.
Claims21
An apparatus comprising:
- a semiconductive wafer portion including a plurality of circuits;
- and
- a buffer coating applied to the semiconductive wafer portion over the circuits, wherein the buffer coating comprises at least a first polymer and at least a second polymer, the first polymer and the second polymer are mechanically blended to produce the buffer coating having:
- increased toughness relative to the first polymer;
- and
- decreased shrinkage relative to the second polymer.
3 more elements
An apparatus comprising:
- a semiconductive wafer portion including a plurality of circuits;
- and
- a buffer coating applied to the semiconductive wafer portion over the circuits, wherein the buffer coating comprises at least a first polymer and at least a second polymer,
- the first polymer and the second polymer are mechanically blended, such that the buffer coating has decreased shrinkage relative to the second polymer, wherein the second polymer is characterized by elongation to break of about ten percent or greater.
1 more element
Dependencies are inferred from the claim text.