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US 7,732,935 B2Granted
Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board
AssigneesRicoh Company, Ltd., Ricoh Microelectronics Co., Ltd.
InventorEiji Moriyama
Life of this patent
Estimating the term…
Abstract
A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.
Claims17
A wiring board comprising:
- a substrate consisting of an insulation material and wired by a conductive material;
- wherein a plurality of electrodes are formed on a surface of the substrate and include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
An electronic circuit board comprising:
- a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate;
- and
- a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board;
- wherein the electrodes formed on the surface of the substrate of the wiring board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
2 more elements
An electronic circuit board comprising:
- a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate;
- and
- a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board,
- wherein the electrodes formed on the surface of the substrate of the wiring board include non-Au electrodes not having Au surface layers and Au electrodes having the Au surface layers as the electrodes,
- at least one of the electronic parts has an Au electrode having an Au surface layer as the contact electrode of the electronic part, the Au surface layer of the contact electrode of the electronic part having a flat contact surface with an area greater than the area of a side surface of the Au surface layer,
- the contact surface is soldered to the non-Au electrode of the wiring board, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
4 more elements
An electronic apparatus comprising:
- an electronic circuit board including
- a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate;
- and
- a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board;
- and
- a housing covering the electronic circuit board;
- wherein the electrodes formed on the surface of the substrate of the wiring board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
5 more elements
An electronic apparatus, comprising:
- an electronic circuit board, including
- a wiring board including a substrate consisting of an insulation material and wired by a conductive material, wherein a plurality of electrodes are formed on a surface of the substrate;
- and
- a plurality of electronic parts having contact electrodes configured to connect to the electrodes formed on the surface of the substrate, the electronic parts being surface-mounted on the wiring board;
- and
- a housing covering the electronic circuit board;
- wherein the electrodes formed on the surface of the substrate of the wiring board of the electronic circuit board include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
5 more elements
A manufacturing method of an electronic circuit board where a plurality of electronic parts are surface-mounted on a wiring board including a substrate consisting of an insulation material and wired by a conductive material, the method comprising the steps of:
- printing a paste lump made of a paste containing a conductive connection material on a plurality of electrodes formed on the substrate consisting of the insulation material;
- mounting the electronic parts on the wiring board via the paste lump;
- and
- connecting the electrodes of the wiring board to the corresponding contact electrodes of the electronic parts by melting the conductive connect material in the paste lump;
- wherein the electrodes are formed on a surface of the substrate and include a non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer, and
- an oxidation prevention film made of a flux of a non-metal material is formed on a surface of the non-Au electrode.
3 more elements
Dependencies are inferred from the claim text.