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US 7,732,934 B2Granted
Semiconductor device having conductive adhesive layer and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorYun-rae Cho
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Abstract
In a semiconductor device, a semiconductor substrate may include a plurality of first conductive pads. An insulating isolation layer may be on the semiconductor substrate so as to separate the first conductive pads. A package substrate may include a plurality of second conductive pads. A conductive adhesive layer may connect the first conductive pads and the second conductive pads.
Claims13
A semiconductor device comprising:
- a semiconductor substrate including a plurality of first conductive pads;
- an insulating isolation layer on the semiconductor substrate separating the first conductive pads;
- a package substrate including a plurality of second conductive pads;
- and
- a conductive adhesive layer connecting the first conductive pads and the second conductive pads,
- wherein the conductive adhesive layer attaches the semiconductor substrate and the package substrate and includes a plurality of interconnection lines separated from each other by the insulating isolation layer and connecting the first conductive pads and the second conductive pads, and
- wherein a shape of a perimeter boundary of each of the interconnection lines in a plan view is defined by a plurality of walls of the insulating isolation layer.
4 more elements
Dependencies are inferred from the claim text.