Cavity-type integrated circuit package
OwnerNeil McLellan, Katherine Wagenhoffer +2inventors
InventorsNeil McLellan, Katherine Wagenhoffer, Geraldine Tsui Yee Lin, Mohan Kirloskar
Life of this patent
Estimating the term…
Abstract
A process for fabricating a cavity-type integrated circuit includes supporting a leadframe strip in a mold. The leadframe strip includes a die attach pad and a row of contact pads circumscribing the die attach pad. A package body is molded in the mold such that opposing surfaces of the die attach pad and of the contact pads are exposed. A semiconductor die is mounted to the die attach pad. Various ones of the contact pads are wire bonded to the semiconductor die and a lid is mounted on the package body to thereby enclose the semiconductor die and the wire bonds in a cavity of the integrated circuit package.
Claims4
A cavity-type integrated circuit package comprising:
- a premolded package body comprising a die attach pad, a plurality of contact pads and a molding material, an outer surface of said package body including an exposed surface of said die attach pad;
- a semiconductor die mounted to a first side of a die attach pad;
- a plurality of wire bonds connecting one or more of said contact pads and said semiconductor die;
- and
- an integrally formed lid mounted on said package body, wherein said package body is pre-molded into a shape of a substantially flat strip, and said lid is shaped to include a cavity therein, thereby enclosing said semiconductor die and said wire bonds in a sealed cavity defined by said package body and said lid.
Dependencies are inferred from the claim text.