Method for embedding a component in a base

A multi-layered circuit board, which includes at least two circuit board substructures on top of each other, at least one of said circuit board substructures comprising:

• an insulating material layer including a baseboard and a hardened insulating polymer layer;
• conductive patterns on both sides of the insulating material layer;
• at least one microcircuit embedded in the insulating material layer, the embedded microcircuit having contact areas on its first surface and the first surface of the microcircuit being against the hardened insulating polymer layer, the at least one microcircuit being inside the insulating material layer in a hole in the baseboard and having the first surface against the hardened insulating polymer layer;
• and
• contact openings in the hardened insulating polymer layer and copper in the contact openings for forming electrical contacts between the contact areas of the microcircuit and at least one of the conductive patterns, wherein the copper contains at least one of electrochemically deposited copper and chemically deposited copper.

A multi-layered circuit board, which includes at least two circuit board substructures on top of each other, at least two of said circuit board substructures each comprising:

• an insulating material layer including a baseboard and a hardened insulating polymer layer;
• conductive patterns on both sides of the insulating material layer;
• at least one microcircuit embedded in the insulating material layer, the embedded microcircuit having contact areas on its first surface and the first surface of the microcircuit being against the hardened insulating polymer layer;
• and
• contact openings in the hardened insulating polymer layer and copper in the contact openings for forming electrical contacts between the contact areas of the microcircuit and at least one of the conductive patterns,
• wherein the copper contains at least one of electrochemically deposited copper and chemically deposited copper, and
• at least one of said at least two circuit board substructures further comprises a metal foil below at least one of the microcircuits.