Integrated circuit package system with edge connection system
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Joon Han, Il Kwon Shim, Seng Guan Chow
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Abstract
An integrated circuit package system including a plurality of substrates and a plurality of semiconductor devices formed on each of the substrates. An edge connection system is provided and an electrical edge connector on each of the substrates is for attachment to the edge connection system. A vertically stacked configuration of the substrates is formed by attaching the substrates to the edge connection system.
Claims20
A method of manufacture of an integrated circuit package system comprising:
- providing a plurality of substrates;
- forming a plurality of semiconductor devices on at least one of the plurality of substrates;
- forming an interposer with contacts between adjacent substrates;
- providing an edge connection system;
- configuring an electrical edge connector on at least one of the plurality of substrates for attachment to the edge connection system;
- and
- forming a vertically stacked configuration of the substrates by inserting the plurality of substrates into the edge connection system.
A method of manufacture of an integrated circuit package system comprising:
- providing an edge connection system;
- providing a plurality of substrates including electrical edge connectors, the substrates inserted into the edge connection system;
- forming a heat spreader between the plurality of substrates that require heat dissipation;
- and
- forming a secondary support structure slidably separating the plurality of substrates or one of the plurality of substrates and the heat spreader.
An integrated circuit package system comprising:
- a plurality of substrates;
- a plurality of semiconductor devices on at least one of the plurality of substrates;
- an interposer with contacts between adjacent substrates;
- an edge connection system;
- an electrical edge connector on at least one of the plurality of substrates for attachment to the edge connection system;
- and
- the plurality of substrates inserted within the edge connection system in a vertically stacked configuration.
Dependencies are inferred from the claim text.