High capacity memory module using flexible substrate

A memory module comprising:

• a module substrate;
• and
• a plurality of package units set on the module substrate such that the package units partially overlap each other, each package unit comprising:
• at least one memory semiconductor package;
• and
• a flexible substrate having outer terminals provided over a lower surface of the flexible substrate adjacent to one edge thereof to form electrical connections with the module substrate,
• wherein the memory semiconductor package is attached to one surface or each of both upper and lower surfaces of the flexible substrate;
• wherein the portion of the flexible substrate which is provided with the outer terminals is down-set such that the outer terminals are disposed at the overlapped portion of the package units;
• wherein the plurality of package units are respectively set on the module substrate such that a portion of the memory semiconductor package of another adjoining package unit overlaps the flexible substrate and is placed over an opposite edge of the flexible substrate of one package unit which is not provided with the outer terminals;
• and
• wherein the electrical connections are made to bring the outer terminals into contact with a plurality of electrode terminals of the module substrate disposed at corresponding positions to the outer terminals.