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US 7,732,901 B2Granted
Integrated circuit package system with isloated leads
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Hadap Advincula, Jr., Lionel Chien Hui Tay
Life of this patent
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Abstract
An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.
Claims20
An integrated circuit package system comprising:
- a finger;
- a die pad adjacent the finger;
- a fill material around the finger and the die pad;
- a cavity in the finger and fill material;
- and
- an integrated circuit die over the die pad adjacent the finger with the fill material.
3 more elements
A method of manufacture of an integrated circuit package system comprising:
- forming a finger;
- forming a die pad adjacent the finger;
- applying a fill material around the finger and the die pad;
- forming a cavity in the finger and fill material;
- and
- attaching an integrated circuit die over the die pad adjacent the finger with the fill material.
3 more elements
A method of manufacture of an integrated circuit package system comprising:
- forming a finger;
- forming a die pad adjacent the finger;
- applying a fill material around the finger and the die pad;
- forming a cavity in the finger and fill material;
- attaching an integrated circuit die over the die pad adjacent the finger with the fill material;
- and
- attaching a die connector to the integrated circuit die and the finger.
4 more elements
Dependencies are inferred from the claim text.