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US 7,732,894 B2Granted
Electronic components on trenched substrates and method of forming same
AssigneeInternational Business Machines Corporation
InventorsDavid Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
Life of this patent
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Abstract
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
Claims20
An electronic module, comprising:
- a substrate having at least one structure that reduces stress flow through the substrate;
- and
- an electronic component mounted on the substrate,
- wherein said structure comprises at least one trench in a surface of the substrate,
- wherein said at least one trench is formed around a plurality of capacitor legs, said capacitor legs mounting the electronic component to the substrate,
- wherein said at least one trench comprises a plurality of trench extension slits extending from each of said trenches and extending between the plurality of capacitor legs.
3 more elements
An electronic module, comprising:
- a substrate;
- an electronic component mounted above the substrate;
- a plurality of capacitor legs, the capacitor legs mounting the electronic component to the substrate;
- and
- at least one trench in a surface of the substrate, the at least one trench being formed around the plurality of capacitor legs.
2 more elements
An electronic module, comprising:
- a substrate having at least one structure that reduces stress flow through the substrate;
- and
- an electronic component mounted on the substrate,
- wherein said structure comprises at least one trench in a surface of the substrate,
- wherein said at least one trench is formed around a plurality of capacitor legs, said capacitor legs mounting the electronic component to the substrate.
2 more elements
Dependencies are inferred from the claim text.