Back to results
US 7,732,873 B2Granted
Non-volatile semiconductor memory device and process of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsToshitake Yaegashi, Koki Ueno
Life of this patent
Estimating the term…
Abstract
In device isolation trenches, a first device-isolation insulator film is formed to have recesses thereon and a second device-isolation insulator film is formed in the recesses. The uppermost portions at both ends of the first device-isolation insulator film are located higher than the uppermost portions at both ends of the second device-isolation insulator film.
Claims9
A non-volatile semiconductor memory device, comprising:
- a semiconductor substrate having device formation regions defined by device isolation trenches;
- a first gate insulator film formed over said device formation regions;
- a floating gate formed on said first gate insulator film;
- a first device-isolation insulator film formed in said device isolation trenches and having recesses thereon, and contacted with the floating gate;
- a second device-isolation insulator film formed in said recesses;
- a second gate insulator film formed over a surface of said floating gate and said first and second device-isolation insulator films;
- and
- a control gate formed above said floating gate and said first and second device-isolation insulator films via said second gate insulator film, wherein the uppermost portions at both ends of said first device-isolation insulator film are located higher than the uppermost portions at both ends of said second device-isolation insulator film,
- wherein said second device-isolation insulator film is higher in etching rate than said first device-isolation insulator film under a certain etching condition.
6 more elements
Dependencies are inferred from the claim text.