A semiconductor structure comprising a first gate stack, a second gate stack, a third gate stack, and a fourth gate stack, each located on a semiconductor substrate, wherein said second gate stack constitutes a gate of a p-type field effect transistor and said fourth gate stack constitutes a gate of an n-type field effect transistor, wherein said first gate stack comprises:
- a first high dielectric constant (high-k) material portion located on a first semiconductor portion of said semiconductor substrate;
- a metal oxide portion vertically contacting said first high-k material portion and comprising a different material than said high-k material;
- and
- a first conductive metal nitride portion vertically contacting said metal oxide portion and comprising a conductive metal nitride;
- wherein said second gate stack comprises:
- a second high dielectric constant (high-k) material portion located on a second semiconductor portion of said semiconductor substrate;
- and
- a second conductive metal nitride portion vertically contacting said second high-k material portion and comprising said conductive metal nitride;
- wherein said third gate stack comprises:
- a semiconductor oxide based gate dielectric portion located on a third semiconductor portion of said semiconductor substrate and comprising a semiconductor oxide or a semiconductor oxynitride;
- wherein said fourth gate stack comprises:
- a third high dielectric constant (high-k) material portion located on a fourth semiconductor portion of said semiconductor substrate;
- and
- a third conductive metal nitride portion vertically contacting said third high-k material portion and comprising said conductive metal nitride;
- and
- wherein said first, second, and third high-k material portions are composed of a high-k material having a same composition and a dielectric constant greater than 4.0, and said conductive metal nitride has a same composition in said first, second, and fourth gate stacks.