Optoelectronic device submount
AssigneeHymite A/S
InventorThomas Murphy
Life of this patent
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Abstract
A submount for an optoelectronic device includes a substrate, a first top pad on a top surface of the substrate, a first bottom pad on a bottom surface of the substrate and a first wrap-around contact in a sidewall recess of the substrate, in which the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad. Alternatively, or in addition, the submount includes a device mounting pad on the top surface of the substrate, a wire-bond pad on the top surface of the substrate, a contact pad on the bottom surface of the substrate and a feedthrough contact which extends through the substrate and electrically couples the wire-bond pad to the contact pad.
Claims37
A submount for an optoelectronic device comprising:
- a silicon substrate;
- a first top pad on a top surface of the substrate;
- a first bottom pad on a bottom surface of the substrate;
- and
- a first wrap-around contact in a recess of a first exterior sidewall of the substrate, wherein the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad,
- wherein the recess in the first exterior sidewall is defined at least in part by a sidewall slanted with respect to a plane that is perpendicular to the top and bottom surfaces of the substrate.
A submount for an optoelectronic device comprising:
- a silicon substrate;
- a first top pad on a top surface of the substrate;
- a first bottom pad on a bottom surface of the substrate;
- a first wrap-around contact in a recess of a first exterior sidewall of the substrate, wherein the first wrap-around contact is coupled electrically to the first top pad and to the first bottom pad;
- a second top pad on the top surface of the substrate;
- a second bottom pad on the bottom surface of the substrate;
- and
- a second wrap-around contact in a recess of a second exterior sidewall of the substrate, wherein the second wrap-around contact is coupled electrically to the second top pad and to the second bottom pad,
- wherein each of the recess in the first exterior sidewall and the recess in the second exterior sidewall is defined at least in part by a respective sidewall slanted with respect to a plane that is perpendicular to the top and bottom surfaces of the substrate.
A submount for an optoelectronic device comprising:
- a silicon substrate;
- a device mounting pad on a top surface of the substrate;
- a wire-bond pad on the top surface of the substrate;
- a contact pad on the bottom surface of the substrate;
- and
- a feedthrough contact extending through the substrate and electrically coupling the wire-bond pad to the contact pad, wherein the feedthrough contact is on a sidewall of a feedthrough opening such that an unobstructed passageway extends from the top surface through the substrate to the bottom surface.
A method of fabricating an optoelectronic submount comprising:
- forming a plurality of cavities in a silicon substrate, wherein each opening in a cavity extends from a bottom surface of the substrate to a top surface of the substrate;
- depositing a metal layer on a top and bottom surface of the substrate and on a sidewall of each cavity and sealing the cavity openings with metal;
- patterning the metal layer to form a landing pad and wire-bond pad on the substrate top surface and a contact pad and a SMD pad on the substrate bottom surface, wherein the metal layer on a first cavity sidewall electrically couples the landing pad to the contact pad and wherein the metal layer on a second cavity sidewall electrically couples the wire-bond pad to the SMD pad;
- and
- dicing the substrate through a pair of the cavities to form the submount with a first wrap-around contact in a recess of a first exterior sidewall and a second wrap-around contact in a recess of a second exterior sidewall.
A submount for an optoelectronic device comprising:
- a silicon substrate;
- a device mounting pad on a top surface of the substrate;
- a wire-bond pad on the top surface of the substrate;
- a contact pad on the bottom surface of the substrate;
- a feedthrough contact extending through the substrate and electrically coupling the wire-bond pad to the contact pad;
- and
- a solder dam on the bottom surface of the substrate, wherein the solder dam couples the feedthrough contact to the contact pad.
Dependencies are inferred from the claim text.