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US 7,732,712 B2Granted
Wiring board and method for manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorTakaharu Yamano
Life of this patent
Estimating the term…
Abstract
A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.
Claims12
A wiring board comprising:
- a semiconductor chip;
- an insulating layer in which the semiconductor chip is embedded;
- a wiring connected to the semiconductor chip;
- and
- reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer and being spaced away the semiconductor chip by said insulating layer,
- wherein the semiconductor chip is embedded in the insulating layer such that the insulating layer surrounds and is directly on exposed surfaces of the semiconductor chip.
3 more elements
A method for manufacturing a wiring board, the method comprising:
- forming a first reinforcing layer on a supporting board, the first reinforcing layer reinforcing an insulating layer;
- forming the insulating layer and a wiring on the first reinforcing layer, a semiconductor chip being embedded in the insulating layer such that the insulating layer surrounds and is directly on exposed surfaces of the semiconductor chip, the wiring being connected to the semiconductor chip;
- forming a second reinforcing layer on the insulating layer, the second reinforcing layer reinforcing the insulating layer;
- and
- removing the supporting board,
- wherein the first reinforcing layer and the second reinforcing layer are spaced away from the semiconductor chip by the insulating layer.
3 more elements
Dependencies are inferred from the claim text.