Method of fabricating semiconductor device with reduced pitch

A method of fabricating a semiconductor device, comprising:

• depositing a desired workpiece film above a semiconductor substrate and further depositing a first film on the workpiece film so that a resist is formed above the first film, the resist being patterned into a line-and-space pattern with a predetermined pitch;
• processing the first film with the resist serving as a mask, removing the resist and thereafter depositing a second film along a surface of the processed first film, the second film having a film thickness that is one third of the predetermined pitch, and processing the second film so that upper surfaces of the first film and the workpiece are exposed and so that the second film is left on a sidewall of the first film;
• depositing a third film on the exposed workpiece, the exposed first film, and the second film;
• planarizing the third film so that the upper surface of the first film is exposed;
• removing the first film exposed by the planarizing process so that the sidewall of the second film is exposed;
• depositing a fourth film along the sidewall of the exposed second film and an upper surface of the planarized third film, the fourth film having a film thickness that is one third of the predetermined pitch;
• removing the fourth film formed on the upper surfaces of the planarized third film and the workpiece so that the upper surfaces of planarized third film and the workpiece are exposed and the fourth film is left on the sidewall of the second film;
• depositing a fifth film on the exposed upper surfaces of the planarized third film and the workpiece and the fourth film;
• planarizing the fifth, second, third, and fourth films so that the upper surfaces of the second, third, fourth, and fifth films are exposed;
• removing the exposed third and fourth films;
• and
• processing the workpiece film while the second and fifth films left as the result of removal of the third and fourth films serve as a mask,
• wherein:
• an inclined face is formed on an upper part of the second film in the leaving the second film only on the sidewall of the first film;
• an inclined face is formed on an upper part of the fourth film in the removing the fourth film on the sidewall of the second film;
• and
• in the exposing the upper surfaces of the second, third, fourth and fifth films, planarization is carried out until the inclined faces of the second and fourth films are removed.