Chemical mechanical polishing method with inspection pre and post processing
AssigneeUnited Microelectronics Corp.
InventorHui-Shen Shih
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Abstract
The invention is directed to a chemical mechanical polishing process. The chemical mechanical polishing process comprises steps of providing a wafer disposed at a wafer handling region of a chemical mechanical polishing apparatus and then moving the wafer into a buffer region of the chemical mechanical polishing apparatus. A first detecting process is performed for obtaining a pre-polishing condition of the wafer by using a detector in the buffer region and the wafer is moved into a chemical mechanical polishing region and performing a chemical mechanical process. A second detecting process is performed, in the buffer region, for obtaining a post-polishing condition of the wafer by using the detector of the buffer region.
Claims8
A chemical mechanical polishing process, comprising:
- providing a wafer disposed at a wafer handling region of a chemical mechanical polishing apparatus;
- moving the wafer into a buffer region of the chemical mechanical polishing apparatus;
- performing a first detecting process for obtaining a pre-polishing condition of the wafer by using a detector in the buffer region, wherein after the first detecting process, performing a cleaning process when the pre-polishing condition shows that a surface of a polished-to-be material layer of the wafer is peeling so as to remove the peeling;
- moving the wafer into a chemical mechanical polishing region and performing a chemical mechanical process;
- and
- performing a second detecting process, in the buffer region, for obtaining a post-polishing condition of the wafer by using the detector of the buffer region.
Dependencies are inferred from the claim text.