Method of fabricating semiconductor package structure
AssigneeSamsung Electronics Co., Ltd.
InventorsYong-Chai Kwon, Dong-Ho Lee
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Abstract
A semiconductor package structure and a method of fabricating the same are disclosed. A method of fabricating the semiconductor package structure can be characterized as including forming semiconductor chips on a semiconductor substrate. Each of the semiconductor chips includes chip pads. Through-vias are formed through the semiconductor chips. Redistribution structures and a chip selection interconnection layer are formed on the semiconductor chips, which connect the through-vias with the chip pads. The chip selection interconnection layers are patterned to form chip selection interconnection lines having different structures on at least one of the semiconductor chips. The semiconductor chips are stacked and electrically connected using the through-vias.
Claims12
A method of forming a semiconductor device, the method comprising:
- providing semiconductor chips, each semiconductor chip including chip pads;
- forming through-vias extending through each of the semiconductor chips;
- forming redistribution structures and a chip selection interconnection layer on each of the semiconductor chips, the redistribution structures and the chip selection interconnection layer of each chip connecting the through-vias with the respective chip pads on each of the semiconductor chips;
- patterning the chip selection interconnection layer on each of the semiconductor chips to form chip selection interconnection lines on each of the semiconductor chips, wherein a line-to-pad connection structure of a chip selection interconnection line on one of the semiconductor chips is different from a line-to-pad connection structure of a chip selection interconnection line on another one of the semiconductor chips;
- and
- stacking the semiconductor chips such that the respective through-vias are used to electrically connect the stacked semiconductor chips to one another.
Dependencies are inferred from the claim text.