Vapor deposition of tungsten materials
AssigneeApplied Materials, Inc.
InventorsSang-Hyeob Lee, Avgerinos V. Gelatos, Kai Wu, Amit Khandelwal, Ross Marshall, Emily Renuart, Wing-Cheong Gilbert Lai, Jing Lin
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AssigneeApplied Materials, Inc.
InventorsSang-Hyeob Lee, Avgerinos V. Gelatos, Kai Wu, Amit Khandelwal, Ross Marshall, Emily Renuart, Wing-Cheong Gilbert Lai, Jing Lin
Estimating the term…
Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.
A method for forming a tungsten-containing material on a substrate, comprising:
A method for forming a tungsten-containing material on a substrate, comprising:
A method for forming a tungsten-containing material on a substrate, comprising:
Dependencies are inferred from the claim text.