Dielectric material with reduced dielectric constant and methods of manufacturing the same
AssigneeInternational Business Machines Corporation
InventorsLouis Lu-Chen Hsu, Jack Allan Mandelman, Chih-Chao Yang
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Abstract
In a first aspect, a first method of manufacturing a dielectric material with a reduced dielectric constant is provided. The first method includes the steps of (1) forming a dielectric material layer including a trench on a substrate; and (2) forming a cladding region in the dielectric material layer by forming a plurality of air gaps in the dielectric material layer along at least one of a sidewall and a bottom of the trench so as to reduce an effective dielectric constant of the dielectric material. Numerous other aspects are provided.
Claims9
A method of manufacturing a dielectric material with a reduced dielectric constant, comprising:
- forming a dielectric material layer including a trench on a substrate;
- and
- forming a cladding region in the dielectric material layer by forming a plurality of air gaps in the dielectric material layer along at least one of a sidewall and a bottom of the trench so as to reduce an effective dielectric constant of the dielectric material;
- creating oxide protrusions in the dielectric material layer by forming a porous silicon layer on the substrate and oxidizing the porous silicon layer such that oxygen diffuses through pores of the porous silicon layer and into the dielectric material layer;
- and etching the oxide protrusions from the dielectric material layer.
Dependencies are inferred from the claim text.