Non-leaded semiconductor package and a method to assemble the same
AssigneeInfineon Technologies AG
InventorsMin Wee Low, Tian Siang Yip
Life of this patent
Estimating the term…
Abstract
A method to assemble a non-leaded semiconductor package is disclosed. In one embodiment, a carrier tape is attached to a metal foil. A plurality of leadframes are formed in the metal foil, each leadframe including a die pad laterally surrounded by a plurality of contact leads. A semiconductor die, including an active surface with a plurality of die contact pads, is attached to each die attach pad and electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads. A plurality of leadframes, each including a wire bonded semiconductor die, are encapsulated with mold material. The carrier tape is removed and the non-leaded semiconductor packages separated.
Claims16
A method to assemble a semiconductor package, comprising:
- providing a metal foil;
- attaching a carrier tape to a first side of the metal foil;
- and
- etching a second side of the metal foil opposite the first side to form a plurality of leadframes in the metal foil, each leadframe comprising a die pad laterally surrounded by a plurality of contact leads, wherein each of the leadframes is spatially isolated from neighboring leadframes, and wherein each of the contact leads and its respective die pad have a space therebetween with the contact leads and the die pad having protruding portions extending into the space.
A leadframe strip assembly comprising:
- a carrier tape including a metal foil attached thereon;
- and
- a plurality of leadframes formed in the metal foil, each leadframe comprising a die pad laterally surrounded by a plurality of contact leads in the metal foil;
- the die pad and the contact leads each having sidewalls, wherein the contact leads are spaced apart from the die pads such that the sidewalls of the die pad and the contact leads form a space therebetween;
- the sidewalls of the die pad and the contact leads each having a protruding portion that extends into the space;
- wherein the die pads, the contact leads and the protruding portions each have an upper surface that lies in a common plane.
A non-leaded semiconductor package comprising:
- a leadframe comprising a die attach pad approximately in its lateral centre, laterally surrounded by a plurality of contact leads each having a contact area;
- the die pad and the contact leads each having sidewalls, wherein the contact leads are spaced apart from the die pads such that the sidewalls of the die pad and the contact leads form a space therebetween:
- the sidewalls of the die pad and the contact leads each having a protruding portion that extends into the space. wherein the die pads, the contact leads and the protruding portions each have an upper surface that lies in a common plane;
- semiconductor die including an active surface with a plurality of die contact pads and a passive surface, wherein the passive surface is attached to the die attach pad by die attach material, and the active surface is electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads;
- the upper surface of the die, contact leads, bond wires and space between the die pad and contact leads being encapsulated with mold material;
- and
- the mold material, a bottom surface of the die attach pad and a bottom surface of the contact leads form an essentially common plane.
Dependencies are inferred from the claim text.