Lead frame and method for fabricating semiconductor package employing the same

A method for fabricating a semiconductor package, comprising:

• preparing a lead frame, the lead frame including a die pad, inner and outer leads arranged along an outer periphery of the die pad and having tip terminals, and a connecting bar for connecting tip terminals of the inner leads, the connecting bar being deposited around the die pad, each one end of an inner lead being connected to the connecting bar and each other end of the lead being connected to an outer lead;
• mounting a bonding pad of a semiconductor chip on the die pad;
• connecting the bonding pad to at least one tip terminal of an inner lead via a wire;
• cutting the connecting bar which connects the tip terminals of the inner leads so as to independently separate each of the inner leads from the die pad and from each other;
• and
• molding the semiconductor chip, wire and the inner leads with molding resin,
• the molding occurring after the connecting of the bonding pad to at least one terminal, the cutting occurring after the connecting of the bonding pad to at least one tip terminal.

A method for fabricating a semiconductor package that includes a lead frame, the lead frame having a die pad, inner and outer leads arranged along an outer periphery of the die pad and having tip terminals, and a connecting bar for connecting tip terminals of the inner leads to the die pad, the method comprising:

• connecting, via a conductive wire, a bonding pad of a semiconductor chip to be mounted on the die pad of the lead frame to the inner leads of the lead frame, the connecting bar being deposited around the die pad, each one end of an inner lead being connected to the connecting bar and each other end of the lead being connected to an outer lead;
• molding the semiconductor chip, wire and inner leads;
• and
• cutting the connecting bar which connects the tip terminals of the inner leads so as to independently separate each of the inner leads from the die pad,
• the molding occurring after the connecting, the cutting occurring after the connecting.