Multi-chip package system incorporating an internal stacking module with support protrusions
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Heap Hoe Kuan, Rui Huang
Life of this patent
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Abstract
The present invention provides a multi-chip package system that includes: providing a package substrate; attaching a base semiconductor die to the package substrate; connecting an interconnect between the base semiconductor die and the package substrate; and encapsulating at least portions of the package substrate, the base semiconductor die, and the interconnect with an encapsulant defining a support protrusion adjacent to the interconnect and substantially perpendicular to the package substrate, a cavity bounded by the support protrusion, and a gap linking the cavity to the edge of the encapsulant.
Claims20
A method of manufacturing a multi-chip package system comprising:
- providing a package substrate;
- attaching a base semiconductor die to the package substrate;
- connecting an interconnect between the base semiconductor die and the package substrate;
- and
- encapsulating at least portions of the package substrate, the base semiconductor die, and the interconnect with an encapsulant defining a support protrusion adjacent to the interconnect and substantially perpendicular to the package substrate, a cavity bounded by the support protrusion, and a gap linking the cavity to the edge of the encapsulant.
A method of manufacturing a multi-chip package system comprising:
- providing a package substrate;
- attaching a base semiconductor die to the package substrate;
- connecting an interconnect between the base semiconductor die and the package substrate;
- encapsulating at least portions of the package substrate, the base semiconductor die, and the interconnect with an encapsulant defining a support protrusion adjacent to the interconnect and substantially perpendicular to the package substrate, a cavity bounded by the support protrusion, and a gap linking the cavity to the edge of the encapsulant;
- attaching a base package substrate to the support protrusion;
- connecting an interconnect between the base package substrate and the package substrate;
- and
- encapsulating at least portions of the package substrate, the support protrusion, the cavity, the base package substrate, and the interconnect using an encapsulant.
A multi-chip package system comprising:
- a package substrate;
- a base semiconductor die attached to the package substrate;
- an interconnect connecting the base semiconductor die to the package substrate;
- a support protrusion adjacent to the interconnect and substantially perpendicular to the package substrate;
- a cavity bounded by the support protrusion;
- and
- a gap linking the cavity to the edge of the package substrate.
Dependencies are inferred from the claim text.