Method of manufacturing an image sensing apparatus in which two members are bonded together

A method of manufacturing a solid-state image sensing apparatus, the method comprising steps of:

• forming a separation layer on a first surface of a first member that has first and second surfaces, and forming first circuit elements above the separation layer, the first circuit elements being two-dimensionally arrayed and each of the first circuit elements including a photoelectric conversion element;
• forming second circuit elements and electrode pads on a third surface of a second member that has third and fourth surfaces, wherein the second circuit elements are two-dimensionally arrayed, and wherein each of the second circuit elements corresponds to a respective one of the photoelectric conversion elements and is configured to control the corresponding photoelectric conversion element, to process a signal obtained from the corresponding photoelectric conversion element, and to output the processed signal to a corresponding electrode pad;
• making a side of the first surface of the first member oppose a side of the third surface of the second member via a light shielding film, and forming a bonded body of the first member and the second member, such that the first circuit elements are connected to the second circuit elements to compose an image sensor, and such that the light shielding film is arranged between the first circuit elements and the second circuit elements;
• and
• separating the first member at the separation layer after the bonded body is formed,
• wherein the second circuit elements are configured to process signals in parallel, the signals being obtained from corresponding ones of the photoelectric conversion elements, and to output the processed signals to corresponding ones of the electrode pads in parallel.