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US 7,732,226 B2Granted
Method of manufacturing flash memory device
AssigneeDongbu HiTek Co., Ltd.
InventorYong Wook Shin
Life of this patent
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Abstract
Disclosed are methods of manufacturing a flash memory device. The method can include performing a first test on memory banks of chips on a wafer to record an availability of the banks; performing an inking process on each of the chips according to a number of available banks in the chip; performing a sawing process to divide the chips mounted on the wafer; packaging the divided chips according to the number of available banks in the chip; and performing a verification test on the packaged chips.
Claims20
A method of manufacturing a flash memory device, comprising:
- providing a wafer comprising a plurality of chips, wherein each chip comprises a plurality of banks for a flash memory;
- performing a first test process on the banks to record an availability of the banks for each chip;
- performing an inking process on each of the chips according to a number of available banks in the chip;
- performing a sawing process with respect to the wafer to divide the chips;
- and
- packaging the divided chips in accordance with the number of the available banks.
3 more elements
Dependencies are inferred from the claim text.