Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorNaoyuki Toyoda
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AssigneeSeiko Epson Corporation
InventorNaoyuki Toyoda
Estimating the term…
Aspects of the invention can provide a bank forming method capable of forming banks having a good shape with excellent productivity. Banks for partitioning a predetermined area of a base member can be formed on the base member by radiating light onto the base member on which a sublimation layer containing a sublimation material is formed and sublimating the sublimation material.
A method of forming a bank that partitions a predetermined area of a base member on the base member and forming a wiring pattern on the base member, the method comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or…
Using liquid deposition, e.g. spin coating: using printing techniques, e.g. ink-jet printing or screen printing
By ink-jet printing or drawing by dispensing: by ink-jet printing
Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809: special local insulating pattern, e.g. as dam around…
About 1 year 3 months of term left · ends 15 Jan 2028 (estimated)
1. Field of Invention
Aspects of the invention can relate to a bank forming method of partitioning a predetermined area on a base member, a wiring pattern forming method using the banks, an electro-optical device, and an electronic apparatus.
2. Description of Related Art
The invention will be described with reference to the accompanying drawings, wherein like numerals reference like elements, and wherein:
FIG. 1 is a schematic diagram illustrating an exemplary embodiment of a bank forming apparatus used in a bank forming method according to the invention;
FIG. 2 is a schematic diagram illustrating an exemplary embodiment of the bank forming method according to the invention;
Hereinafter, an exemplary bank forming method according to the invention will be described with reference to the accompanying drawings. FIG. 1 is a schematic diagram illustrating an exemplary embodiment of a bank forming apparatus used in the bank forming method according to the invention. In FIG. 1, the bank forming apparatus 10 can include a laser source 11 for radiating a laser beam having a predetermined wavelength and a stage 12 for supporting a base member 1 which is a processing target. A sublimation layer 2 containing a sublimation material is formed on the top surface of the base member 1. The laser source 11 and the stage 12 for supporting the base member 1 are placed within a chamber 14. A suction apparatus 13 for sucking gas inside the chamber 14 is connected to the chamber 14. In this exemplary embodiment, a near-infrared semiconductor laser (with a wavelength of 830 nm) is used as the laser source 11.
In the following description, it is assumed that a predetermined direction in a horizontal plane is an X axis direction, a direction perpendicular to the X axis direction in the horizontal plane is a Y axis direction, and a direction (a vertical direction) perpendicular to the X axis direction and the Y axis direction is a Z axis direction.
The stage 12 is provided to be movable in the X axis direction and the Y axis direction while supporting the base member 1, and the base member 1 is movable with respect to the light beam radiated from the light source 11 through movement of the stage 12. Further, the stage 12 is movable in the Z axis direction. Here, an optical system not shown is disposed between the light source 11 and the base member 1 supported by the stage 12.