Method for the fabrication of conductive electronic features
AssigneeCabot Corporation
InventorsToivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
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Abstract
Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
Claims37
A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
- (a) providing a substrate;
- (b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound of a metal;
- (c) transferring said tape composition from said carrier to said substrate in a pattern of features;
- and
- (d) heating said transferred tape composition to a temperature of not greater than about 200° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 100 times the resistivity of said metal.
A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
- (a) providing a substrate;
- (b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound to a metal;
- (c) transferring said tape composition from said carrier of said substrate in a pattern of features;
- and
- (d) heating said transferred tape composition to a temperature of not greater than about 175° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 10 times the resistivity of said metal.
A method for the fabrication of a conductive electronic feature on a substrate, comprising the steps of:
- (a) providing a substrate;
- (b) providing a ribbon structure comprising a tape composition on a carrier, said tape composition comprising a molecular precursor compound to a metal;
- (c) transferring said tape composition from said carrier of said substrate in a pattern of features;
- and
- (d) heating said transferred tape composition to a temperature of not greater than about 200° C. to convert said tape composition to a conductive feature having a resistivity of not greater than 6 times the resistivity of said metal.
Dependencies are inferred from the claim text.