Slurry for chemical mechanical polishing of aluminum
AssigneeIntel Corporation
InventorsAllen Daniel Feller, Anne E. Miller
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Abstract
Described herein are embodiments of a slurry used for the chemical mechanical polishing a substrate that includes aluminum or an aluminum alloy features having a width of less than 1 um. The slurry includes a precipitated silica abrasive having a diameter of less than or equal to 100 nm and a chelating buffer system comprising citric acid and oxalic acid to provide a pH of the slurry in the approximate range of 1.5 and 4.0.
Claims8
A chemical mechanical polishing slurry to polish aluminum or an aluminum alloy, the slurry comprising:
- a precipitated silica abrasive having a diameter of less than or equal to 100 nm;
- a chelating buffer system comprising citric acid and oxalic acid to provide a pH of the slurry in an approximate range of 1.5 to 4.0;
- and
- a reactive silanol agent comprising tetraethylorthosilicate (TEOS) provided to act as an interference agent.
A chemical mechanical polishing slurry to polish aluminum or aluminum alloys, the slurry comprising:
- a precipitated silica abrasive having a diameter in the approximate range of 10 nm and 50 nm;
- a chelating buffer system comprising citric acid and oxalic acid to provide a pH in the approximate range of 1.8 to 2.1;
- a reactive silanol agent comprising tetraethylorthosilicate (TEOS) provided to act as an interference agent;
- water;
- and
- reaction products thereof.
Dependencies are inferred from the claim text.