Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

A method of processing a workpiece comprising an upper surface, a field region defined by the upper surface, and a cavity having a depth below the upper surface and having a width, the width being greater than the depth, the method comprising:

• forming a conductive material over the upper surface, within the cavity, and overfilling the cavity to create a bump of the conductive material over the cavity, the bump protruding above the upper surface more than the conductive material protrudes above the upper surface in the field region, wherein forming the conductive material comprises:
• electroplating the conductive material onto the workpiece from an electrolyte solution in contact with the workpiece and an electrode;
• and
• sweeping a workpiece surface influencing device over the upper surface at a time when a top surface of the conductive material includes a depression over the cavity after forming the conductive material, completely removing the conductive material from the field region, wherein, after the removing, parts of the bump remain above the upper surface of the cavity.

A method of processing a workpiece comprising an upper surface and a cavity, the cavity having a depth below the upper surface and having a width, the width being greater than the depth, the method comprising:

• forming a first layer of a conductive material comprising a conductor over the upper surface and within the cavity, wherein forming the first layer includes electroplating the conductor from a first electrolyte solution in contact with the workpiece and an electrode;
• after forming the first layer, contacting the first layer over the upper surface with a workpiece surface influencing device;
• after contacting the first layer, forming a second layer of the conductive material over the first layer, wherein forming the second layer includes electroplating the conductor from a second electrolyte solution, wherein after forming the second layer, a thickness of the conductive material over the cavity and above the upper surface is greater than a thickness of the conductive material over the upper surface;
• and
• after forming the second layer, completely removing the conductive material over the upper surface, wherein, after the removing, parts of the conductive material remain over the cavity and above the upper surface.