Printed board with component mounting pin
AssigneeIbiden Co., Ltd.
InventorsTakashi Kariya, Toshiki Furutani, Takeshi Kawanishi
Life of this patent
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Abstract
A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).
Claims20
A printed circuit board comprising:
- an insulating layer;
- an outermost conductor layer having an electrode land, the outermost conductor layer being formed on the insulating layer;
- and
- a component mounting pin extending from the electrode land, wherein the component mounting pin is made of a conductive material having a property of at least one of flexibility, elasticity or pliability such that the component mounting pin is configured to be urged against an electrode pad of an electronic component by mechanical force of repulsion and not be soldering so as to electrically connect the printed circuit board to the electronic component by way of the component mounting pin.
A printed circuit board comprising:
- an insulating layer;
- an outermost conductor layer having an electrode land, the outermost conductor layer being formed on a surface of the insulating layer;
- and
- a component mounting pin extending from the electrode land, wherein the component mounting pin is made of a conductive material having a property of at least one of flexibility, elasticity or pliability such that the component mounting pin is configured to be connected to an electrode pad of a semiconductor chip of an electronic component through a solder bump such that a surface of the semiconductor chip having the electrode pad thereon opposes the surface of the insulating layer having the electrode land thereon.
Dependencies are inferred from the claim text.