US 7,731,079 B2 · Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Abstract

A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

Claims9

Dependent claims

A method comprising:

obtaining a solder material;
disposing the solder material on a surface to be cooled;
and
reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom, the base being attached to the surface to be cooled and the plurality of fins extending from the base away from the surface to be cooled to facilitate transfer of heat therefrom, wherein the reflowed solder material configured as the base with the plurality of fins extending therefrom is a single, monolithic structure attached to the surface to be cooled.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

12/143,289Filed 20 Jun 2008

Published

US 2009/0316360 A124 Dec 2009

Granted

8 Jun 2010

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10W 40/475
By flowing liquids, e.g. forced water cooling: using jet impingement
H10W 40/47
Involving heat exchange by flowing fluids: by flowing liquids, e.g. forced water cooling
H10W 74/15
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills
H10W 90/724
Of bump connectors: between a chip and a stacked insulating package substrate, interposer or RDL

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Life of this patent

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Life of this patent

Abstract

Claims9