US 7,731,078 B2 · Semiconductor system with fine pitch lead fingers

Abstract

A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality of lead fingers, the plurality of bumps are on the tops and extend down the sides of the plurality of lead fingers. A plurality of bond wires is attached to the plurality of contact pads and to the plurality of bumps. An encapsulant is formed over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

Claims10

Dependent claims

A semiconductor package system comprising:

a die having a plurality of contact pads;
a leadframe having a plurality of lead fingers with flat tops of predetermined lengths, the plurality of lead fingers having a fine pitch and each having a trapezoidal cross-section;
a plurality of bumps on the plurality of lead fingers, the plurality of bumps on the tops, extending beyond the widths of the trapezoidal cross-sections, and clamping down on the two sides of each of the plurality of lead fingers;
a plurality of bond wires attached to the plurality of contact pads, the plurality of bond wires to the plurality of bumps;
and
an encapsulant over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant with lower surfaces of the plurality of lead fingers exposed.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor system with fine pitch lead fingers

Life of this patent

Semiconductor system with fine pitch lead fingers

Life of this patent

Abstract

Claims10