Shear test device
AssigneeNordson Corporation
InventorRobert John Sykes
Life of this patent
Estimating the term…
Abstract
Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element (21) on which is provided a piezo electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.
Claims22
A test apparatus for applying a shear load to a ball deposit on a substrate, the apparatus comprising:
- a support element;
- and
- a piezo-electric crystal on the support element,
- wherein the support element is adapted to apply the shear load to the ball deposit via said piezo-electric crystal, said piezo-electric crystal generating electrical signal in response to stress from the shear load.
A method of performing a shear test on a test tool, the method comprising:
- moving the test tool to contact a portion of a wire;
- shearing the portion of the wire by contact with the moving test tool;
- measuring a shear load applied to the moving test tool by the portion of the wire to perform the shear test;
- and
- comparing the measured shear load with a shear load measured by a different test tool moved to contact and shear another portion of the wire.
A method of performing a shear test on a test tool using a portion of a wire that projects through an aperture in a flat surface, the method comprising:
- indexing the portion of the wire through the aperture;
- moving the test tool to contact the portion of the wire;
- shearing the portion of the wire by contact with the moving test tool;
- and
- measuring a shear load applied to the moving test tool by the portion of the wire to perform the shear test.
A method of performing a shear test on a test tool, the method comprising:
- moving the test tool to contact a portion of a wire;
- shearing the portion of the wire by contact with the moving test tool;
- measuring a shear load applied to the moving test tool by the portion of the wire to perform the shear test;
- and
- moving the test tool to contact a ball deposit of gold or solder on a substrate of a type used in semiconductor devices.
A method of performing a shear test on a test tool using a wire comprised of gold or solder, the method comprising:
- providing a flat surface and an aperture extending through the flat surface that intersects the flat surface at a right angle;
- providing the wire in the aperture;
- indexing a portion of the wire to project above the flat surface;
- after the portion of the wire is indexed to project above the flat surface, moving the test tool to contact the portion of the wire;
- shearing the portion of the wire by contact with the moving test tool;
- and
- measuring a shear load applied to the moving test tool by the portion of the wire to perform the shear test.
A test apparatus for applying a shear load to a ball deposit on a substrate, the apparatus comprising:
- a test head moveable relative to the substrate;
- a test tool supported by the test head;
- and
- a piezo-electric crystal mounted on the test tool,
- wherein the test head is configured to move to contact the deposit with the test tool and apply a shear load to the deposit, thus placing the piezo-electric crystal under stress and causing an electrical signal to emanate from the piezo-electric crystal.
Dependencies are inferred from the claim text.