Method of manufacturing component-embedded printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHwa-Sun Park, Sung Yi, Sang-Chul Lee, Jong-Woon Kim, Yul-Kyo Chung
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Abstract
A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.
Claims3
A method of manufacturing a component-embedded printed circuit board, the method comprising:
- providing a metal-clad laminate comprising a first insulation layer and a first metal layer, the first metal layer being stacked over the first insulation layer, a thickness of the first metal layer being substantially the same as a thickness of the component;
- forming a blind hole in the first metal layer such that a portion of the first insulation layer is exposed;
- securing the component to the first insulation layer by embedding the component in the blind hole;
- stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate;
- and
- forming circuit patterns by removing portions of the metal layers.
Dependencies are inferred from the claim text.