Back to results
US 7,727,052 B2Granted
Removable polishing pad for chemical mechanical polishing
AssigneeARACA, Inc.
InventorLeonard J. Borucki
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeARACA, Inc.
InventorLeonard J. Borucki
Estimating the term…
The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two sheets held together by pegs, pins or protrusions fitted to matching holes in the upper surface of the lower sheet and the lower surface of the upper sheet, said pegs or pins attached to either the upper or lower sheet and able to enter the hold on the adjoining sheet when the sheets are brought together and hold the sheets together by means of the sliding friction attendant upon a tight fit with the said holes. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time. The transparency of the upper sheet further allows users to prevent formation of bubbles in the adhesive holding the CMP pad to the upper sheet, thereby avoiding significant degradation of CMP performance.
A device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon a platen of a CMP polishing apparatus, said device comprising two sheets consisting of an upper sheet attached to the said CMP polishing pad and a lower sheet attached to the said platen, the said two sheets being held together by pegs, pins or protrusions fitted to matching holes in an upper surface of the lower sheet and in a lower surface of the upper sheet, wherein said pegs or pins are attached to one of the upper and the lower sheet and are inserted in the holes of the either sheet, but in no event are the pegs, pins or protrusions inserted so far that the pegs, pins or protrusions protrude above or are even with the upper surface of the upper sheet, when the sheets are brought together, to hold the sheets together by means of sliding friction attendant upon a tight fit with the said holes.
A method for rendering CMP polishing pads easily and temporarily removable from and replaceable upon a platen of a CMP polishing apparatus, by means of a device comprising two sheets consisting of an upper sheet attached to the said CMP polishing pad and a lower sheet attached to the said platen, the said two sheets being held together by pegs, pins or protrusions fitted to matching holes in an upper surface of the lower sheet and in a lower surface of the upper sheet, wherein said pegs or pins are attached to one of the upper and the lower sheet and are inserted in the holes of the either sheet, when the sheets are brought together, to hold the sheets together by means of sliding friction attendant upon a tight fit with the said holes.
Dependencies are inferred from the claim text.