Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

A process for forming bumps on a plurality of electrodes of an electronic component, the process comprising the steps of:

• (i) preparing an electronic component on which a plurality of electrodes are formed, and also a cover having release properties;
• (ii) disposing electrically-conductive particles on said electrodes of said electronic component;
• (iii) supplying a composition comprising solder powder, convection additive and a resin component onto a surface (A) of said electronic component, which is provided with the electrodes;
• wherein the composition is supplied directly onto said electrically-conductive particles and directly onto a surface of the electronic component between electrodes;
• (iv) bringing said cover into contact with the supplied composition;
• (v) heating said supplied composition, and thereby solder bumps are formed on said electrodes from said electrically-conductive particles and said solder powder, and also a resin layer is formed between said electronic component and said cover from said resin component;
• wherein the solder bumps formed on the electrodes are formed through melting the solder powder included in the resin composition by heating the composition to allow the melted solder powder to self-assemble by growing the melted solder powder up to a level of a surface of said cover;
• wherein the electrically-conductive particles, which have a melting point higher than that of the solder powder, serve as nuclei for capturing the melted solder powder;
• and
• (vi) removing said cover.