Apparatus and method for arranging devices for processing
AssigneeASM Assembly Automation Ltd.
InventorsChi Wah Cheng, Hoi Shuen Joseph Tang, Tim Wai Tony Mak, See Lok Chan
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AssigneeASM Assembly Automation Ltd.
InventorsChi Wah Cheng, Hoi Shuen Joseph Tang, Tim Wai Tony Mak, See Lok Chan
Estimating the term…
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
An apparatus for arranging a semiconductor device for processing, the semiconductor device having surface components on its surface and having sides, the apparatus comprising:
An apparatus for arranging a plurality of semiconductor devices for processing, each semiconductor device having surface components on its surface and having sides, the apparatus comprising:
Dependencies are inferred from the claim text.