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US 7,726,323 B2Granted
Device and process for liquid treatment of wafer-shaped articles
AssigneeLam Research Corporation
InventorKurt Langen
Life of this patent
Estimating the term…
Abstract
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article.
Claims12
A device for treating with a liquid a wafer-shaped article, the device comprising:
- a chuck for holding a wafer-shaped article with one surface facing said chuck, said chuck comprising at least one gas conduit for directing a gas supplied through said chuck upwardly toward said one surface of a wafer to be held by said chuck, lateral guide pins positioned about a periphery of said chuck radially outside a peripheral edge of a wafer to be held by said chuck, and a gas guide in a periphery of said chuck and located at least in part radially inwardly of said lateral guide pins;
- wherein said gas guide comprises an edge facing radially inwardly of chuck and confronting gas flowing radially outwardly of said chuck parallel to a wafer-shaped article to be held by said chuck, wherein said gas guide diverts said gas supplied through the chuck downwardly at a position located a predetermined distance radially inward of the lateral guide pins and away from uppermost surfaces of the chuck that are intermediate the lateral guide pins and said position.
Dependencies are inferred from the claim text.