Manufacturing method of printed circuit board
AssigneeInternational Business Machines Corporation
InventorsKohichi Ohsumi, Kenji Terada, Kohichi Yamazaki
Life of this patent
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Abstract
The present invention provides a method of manufacturing a printed circuit board. The method includes the steps of preparing an insulating substrate having a front surface and a back surface and a layer of metal foil formed on each of the front surface and the back surface; selectively forming a plating layer for forming a land on at least one of the metal foils; adjusting a thickness of the plating layer; and forming the metal foils into lines.
Claims19
A method of manufacturing a printed circuit board comprising:
- preparing an insulating substrate having a front surface and a back surface, and a layer of metal foil formed on at least one of said front surface and said back surface, said metal foil having an up surface;
- selectively forming a plating layer on at least one area of said up surface of said metal foil;
- adjusting a thickness of said plating layer;
- forming a resist pattern on areas of said up surface of said metal foil not covered by said plating layer after said plating layer being selectively formed;
- and
- forming said areas of said up surface of said metal foil not covered by said plating layer into one or more conductive lines, said one or more conductive lines being defined by said resist pattern and covering a portion of said up surface.
A method of manufacturing a printed circuit board comprising the steps of:
- preparing an insulating substrate having a front surface and a back surface, and a layer of metal foil formed on at least one of said front surface and said back surface;
- forming an opening in said metal foil and said insulating substrate;
- forming a first resist pattern on said metal foil;
- forming a plating layer on an inner surface of said opening and areas of an up surface of said metal foil not covered by said first resist pattern;
- adjusting a thickness of said plating layer on said metal foil;
- and
- forming areas of said up surface of said metal foil not covered by said plating layer into one or more lines, said one or more lines being separated from said areas of said up surface covered by said plating layer and including a portion of said up surface.
A method of manufacturing a printed circuit board, the method comprising:
- providing an insulating substrate having at least an up surface, said up surface being covered by a layer of metal foil;
- forming a first resist layer of a first resist pattern on said metal foil;
- forming a plating layer on areas of said metal foil not covered by said first resist pattern;
- removing said first resist pattern, thereby exposing said metal foil underneath said first resist pattern, and forming a second resist layer on top of said plating layer and said exposed metal foil, said second resist layer having a second resist pattern on areas of said exposed metal foil previously covered by said first resist pattern;
- and
- forming areas of said exposed metal foil previously covered by said first resist pattern into one or more conductive lines, said one or more conductive lines being separated from areas of said metal foil covered by said plating layer.
Dependencies are inferred from the claim text.