Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring

A circuit board manufacturing method, comprising:

• forming a transfer chip on and above a first substrate, the transfer chip having (1) a bottom adjacent the first substrate, (2) a thin-film electrical circuit formed of stacked films above the first substrate and the bottom and (3) a plurality of transfer chip pad electrodes formed above the stacked films, the pad electrodes including a first pad electrode having a first top positioned at a highest level within the first pad electrode and a second pad electrode having a second top positioned at a highest level within the second pad electrode, the first pad electrode having a first height measured from the bottom of the transfer chip to the first top of the first pad electrode, and the second pad electrode having a second height measured from the bottom of the transfer chip to the second top of the second pad electrode;
• forming a transfer region on a second substrate, the transfer region having (1) electrical circuit wiring and (2) a plurality of transfer region pad electrodes connected to the electrical circuit wiring;
• adjusting at least one of the first height and the second height by adding at least one height adjusting film so that the first height becomes substantially the same as the second height;
• and
• joining the transfer chip to the transfer region on the second substrate, such that the thin-film electrical circuit is electrically connected to the electrical circuit wiring via contact between respective ones of the transfer chip pad electrodes and the transfer region pad electrodes.