Method of forming a micro-electromechanical (MEMS) switch

A method of forming a micro-electromechanical (MEM) switch comprising:

• forming on a substrate at least one inductive coil surrounding an inductive element;
• and
• etching a micro-cavity in said substrate having an opening substantially aligned with said inductive element, said inductive element moving freely within said cavity to a first position when energized by said at least one inductive coil, electrically shorting two conductive wires, and to a second position when de-energized, opening said two shorted conductive wires, said inductive element when de-energized falling from said first position to said second position by gravity, wherein forming said inductive element further comprises:
• conformally depositing sacrificial material on sidewalls of said micro-cavity to a thickness that is determined by a tolerance between the free-moving inductive element to the sidewalls of said micro-cavity;
• depositing conductive material in said micro-cavity;
• planarizing back to fill said micro-cavity;
• recessing said conductive material to a predetermined level of the height of said micro-cavity;
• refilling said micro-cavity with sacrificial material to a top surface of said microcavity;
• and
• selectivity removing said sacrificial material to free said conductive material from said sidewalls of said micro-cavity.