US 7,723,419 B1Granted

Composition providing through plane thermal conductivity

AssigneeOvation Polymer Technology and Engineered Materials, Inc.

InventorsHirishikesh Manian, Asis Banerjie, Nishant Negandhi

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Abstract

This specification discloses a conductive composition relying upon spherical boron nitride particles and thermally expanded graphite to impart high through-plane thermal conductivity in thermoplastics for use in hot environments, including the electronics industry.

Claims20

Dependent claims

A composition comprising boron nitride and expanded graphite wherein the boron nitride in the form of substantially spherical agglomerates having a mean particle size of about 55-65 microns and the weight ratio of the boron nitride to the expanded graphite is in the range of 0.5 to 3.0.

Dependencies are inferred from the claim text.

Facts

Application: 12/211,805Filed 16 Sep 2008 · us provisional application
Priority: 17 Sep 2007
Granted: 25 May 2010
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

C04B 26/02
Compositions of mortars, concrete or artificial stone, containing only organic binders , e.g. polymer or resin concrete: macromolecular compounds
C04B 26/18
Obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds: polyesters; Polycarbonates
C04B 26/20
Obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds: polyamides
C04B 2111/94
Electrical properties: electrically conducting materials

Family

Application60/973,158Us provisional application · filed 17 Sep 2007
US 7,723,419 B1This patent

From the US filing history. Foreign family members aren’t listed.

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