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US 7,718,508 B2Granted
Semiconductor bonding and layer transfer method
OwnerSang-Yun Leeinventor
Life of this patent
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Abstract
The present invention provides a method of coupling substrates together. The method includes providing first and second substrates and then coupling the first and second substrates together. One of the first and second substrates includes devices with an interconnect region positioned thereon and the other substrate carries a device structure.
Claims18
A method of forming a circuit comprising:
- providing a handle substrate;
- providing a donor substrate with a device structure positioned thereon, the device structure including a stack of semiconductor layers;
- coupling the handle and donor substrates together;
- removing the donor substrate from the device structure so that the device structure is carried by the handle substrate;
- providing an acceptor substrate which carries an interconnect region, the interconnect region being electrically coupled to electronic devices carried by the acceptor substrate;
- coupling the device structure and interconnect region together;
- removing the handle substrate from the device structure;
- and
- etching portions of the device structure to form a vertically oriented semiconductor device, the vertically oriented semiconductor device being in communication with the electronic devices carried by the acceptor substrate through the interconnect region.
6 more elements
A method of forming a circuit comprising:
- providing a handle substrate;
- providing a donor substrate with a device structure positioned thereon, the device structure including a stack of semiconductor layers;
- coupling the handle and donor substrates together;
- removing the donor substrate from the device structure so that the device structure is carried by the handle substrate;
- providing an acceptor substrate which carries an interconnect region, the interconnect region being electrically coupled to horizontally oriented electronic devices carried by the acceptor substrate;
- coupling the device structure and interconnect region together;
- removing the handle substrate from the device structure;
- and
- etching the device structure to form a vertically oriented electrical device, the electrical device being coupled to the horizontally oriented electronic devices carried by the acceptor substrate.
6 more elements
A method of forming a circuit comprising:
- providing a handle substrate;
- providing a donor substrate with a device structure positioned thereon, the device structure including a stack of semiconductor layers;
- coupling the handle and donor substrates together;
- removing the donor substrate from the device structure so that the device structure is carried by the handle substrate;
- providing an acceptor substrate which carries an interconnect region positioned on horizontally oriented electronic devices;
- coupling the device structure and interconnect region together;
- removing the handle substrate from the device structure;
- and
- processing the device structure to form a vertically oriented semiconductor device.
6 more elements
Dependencies are inferred from the claim text.