Integrated chip carriers with thermocycler interfaces and methods of using the same

A method of conducting a reaction at a selected temperature or range of temperatures over time, the method comprising:

• providing an array device for containing a plurality of separate reaction chambers, the array device comprising an elastomeric block formed from a plurality of layers, wherein at least one layer has at least one recess formed therein, the recess having at least one deflectable membrane integral to the layer with the recess, the array device further comprising a thermal transfer device proximal to at least one of the reaction chambers, the thermal transfer device being formed to contact a thermal control source;
• introducing into the array device reagents for carrying out a desired reaction;
• contacting the array device with a thermal control device such that the thermal control device is in thermal communication with the thermal control source so that a temperature of the reaction in at least one of the reaction chambers is changed as a result of a change in temperature of the thermal control source;
• and
• automatically controlling and monitoring the carrying out of the method,
• wherein automatically controlling and monitoring the carrying out of the method is performed with an automatic control system in operable communication with a robotic control system for introducing and removing the array device from the thermal control device.

A method of conducting a reaction at a selected temperature or range of temperatures over time, the method comprising:

• providing an array device for containing a plurality of separate reaction chambers, the array device further comprising a thermal transfer device proximal to at least one of the reaction chambers, the thermal transfer device being formed to contact a thermal control source;
• introducing into the array device reagents for carrying out a desired reaction;
• and
• contacting the array device with a thermal control device such that the thermal control device is in thermal communication with the thermal control source so that a temperature of the reaction in at least one of the reaction chambers is changed as a result of a change in temperature of the thermal control source,
• wherein the thermal control device is adapted to apply a force to the thermal transfer device to urge the thermal transfer device towards the thermal control source.