Method and apparatus for grinding a workpiece

Apparatus for cutting profiles in a workpiece without cracking the parent material which includes a grinding wheel having a ceramic grinding surface formed with an optimized grain material and grain spacing to produce large chips that are easily removed from the workpiece;

• drive means for moving the grinding wheel into contact with the workpiece at a predetermined material removal rate which includes a drive motor for the grinding wheel which is operated at a high torque at the low end of the speed range of the motor;
• and a coolant delivery system for delivering a coolant/lubricant to the workpiece at the point where the wheel is applied to the workpiece during the grinding operation and for monitoring predetermined parameters of the coolant/lubricant wherein the drive means is operated to move the grinding wheel into contact with the workpiece at a predetermined material rate until the burning point is reached at the surface of the workpiece by the grinding action of the grinding wheel, and the drive means continues moving the grinding wheel into contact with the workpiece at an increased material removal rate when the burning point is reached at the surface of the workpiece by the grinding action of the grinding wheel.