Heat sink clip

A heat dissipation apparatus comprising:

• a retention frame configured for fixing to a circuit board on which a heat-generating electronic component is mounted, and surrounding the electronic component, the frame comprising first and second catches at two opposite sides thereof;
• a head sink dissipating heat from the electronic component, defining an elongated locating groove through a middle portion thereof;
• and
• a heat sink clip securing the heat sink onto the electronic component, comprising:
• an elongated resilient main body received in the locating groove of the heat sink, the main body forming two spaced barbs at a first end thereof, the barbs each being vertically extended and comprising a neck connecting with the main body and a locking end at a free end of the barb;
• a first locking member at a second end of the main body and engaging the first catch of the retention frame;
• and
• a moveable second locking member movably coupled with the first end of the main body, comprising an operating portion and a locking leg integrally extending downward from the operating portion, the locking leg engaging the second catch of the retention frame and defining two connecting slots therein engagingly receiving the barbs of the main body, each of the connecting slots comprising a longitudinally narrow portion and a longitudinally wide portion therebeside, the barbs inserted into the connecting slots through the wide portions, and the necks of the barbs received in the narrow portions of the slots by which the moveable second locking member connects with the first end of the main body.