Handler for semiconductor singulation and method therefor

An apparatus for cutting a packaged substrate comprising:

• a set of transport guides having a length that extends in a first direction between a loading location, a cutting location, and an unloading location, the cutting location being disposed between the loading location and the unloading location;
• a first movable mount coupled to the set of transport guides, the first movable mount comprising a first rotatable section;
• a second movable mount coupled to the set of transport guides, the second movable mount comprising a second rotatable section;
• a first gantry extending in a second direction and bridging at least a portion of the set of transport guides, the second direction being perpendicular to the first direction;
• and
• a water jet cutting tool coupled to the first gantry and displaceable therealong in the second direction at the cutting location.

An apparatus for cutting a packaged substrate comprising:

• a set of transport guides having a length that extends in a first direction between a loading location, a cutting location, and an unloading location, the cutting location being disposed between the loading location and the unloading location;
• a first movable mount coupled to the set of transport guides, the first movable mount comprising a first rotatable section;
• a first image capture device configured for capturing an image of the packaged substrate disposed on the first movable mount;
• a second movable mount coupled to the set of transport guides, the second movable mount comprising a second rotatable section;
• a first gantry extending in a second, the second direction being perpendicular to the first direction;
• and
• a water jet cutting tool coupled to the first gantry and displaceable therealong in the second direction at the cutting location.

A method for singulating a packaged substrate comprising:

• loading a packaged substrate onto a first movable mount at a loading location;
• transferring the first movable mount to a cutting location;
• cutting the packaged substrate in a first direction;
• transferring the packaged substrate onto a second movable mount;
• cutting the packaged substrate in a second direction;
• and
• transferring the second movable mount to an unloading location,
• wherein at least one of cutting the packaged substrate in the first direction and cutting the packaged substrate in the second direction is performed using a water jet while the packaged substrate is disposed on one of the first movable mount and the second movable mount.